Magnetron sputtering is a type of physical vapor deposition used to prepare films of various materials such as metals, semiconductors, insulators, and the like. In the actual coating process, the deposition rate and sputtering power, sputtering time, distance from the target to the substrate, and working pressure affect the quality and thickness of the coating. In magnetron sputtering coating, as the number of uses increases, the target is consumed, and the target base distance becomes larger. When other parameters are not changed, the coated film will gradually not meet the requirements. The uniformity of the magnetic field affects the uniformity of the film. If the magnetic field is asymmetric, it will cause the position of the coating to shift.
Providing a multifunctional magnetron sputtering coating system that improves the uniformity and stability of magnetron sputtering coating, this system is integrated by a vacuum coating system and a glove box system, which can complete film evaporation in a high vacuum evaporation chamber. Plating, and sample storage, preparation and sample detection after evaporation in a glove box with high purity inert gas atmosphere. The combination of evaporation coating and glove box realizes the fully enclosed production of evaporation, packaging, and testing processes, so that the entire film growth and device preparation process is highly integrated in a complete controllable environment atmosphere system, eliminating the organic large area circuit preparation The influence of unstable factors in the atmospheric environment guarantees the preparation of high-performance, large-area organic optoelectronic devices and circuits.
The multi-purpose magnetron sputtering coating system is mainly used for preparing various metal films, semiconductor films, dielectric films, magnetron films, optical films, superconducting films, sensing films and functional films with special needs.
