The magnetron coating equipment is based on the principle of magnetron sputtering. Electrons collide with argon atoms during the acceleration of electrons flying to the substrate under the action of an electric field. A large amount of argon ions and electrons are ionized and the electrons fly to the substrate. Argon ions accelerate bombardment of the target under the action of an electric field, a large number of target atoms are sputtered, and neutral target atoms (or molecules) are deposited on the substrate to form a film.
In order to overcome the shortcomings of the prior art, a magnetron coating machine is provided.
The combination of a magnetron coating machine, an evaporation coating and a glove box, realizes the fully enclosed production of evaporation, packaging, and testing processes, so that the entire film growth and device preparation process is highly integrated in a complete controllable environment atmosphere system, eliminating organic The influence of unstable factors in the atmospheric environment during the preparation of area circuits ensures the production of high-performance, large-area organic optoelectronic devices and circuits.
The multi-purpose magnetron sputtering coating system is mainly used to prepare various metal films, semiconductor films, dielectric films, magnetron films, optical films, superconducting films, sensing films and functional films with special needs.
The magnetron coating machine and the magnetron sputtering device are set in the vacuum chamber device, and the cycle is performed, which saves time and improves production efficiency.
